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Materials 2017, 10(6), 589; doi:10.3390/ma10060589

Crack Extension and Possibility of Debonding in Encapsulation-Based Self-Healing Materials

Key Laboratory of Advanced Civil Engineering Materials, Tongji University, Ministry of Education, Shanghai 201804, China
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Academic Editor: Abbas S. Milani
Received: 18 April 2017 / Revised: 21 May 2017 / Accepted: 22 May 2017 / Published: 27 May 2017
(This article belongs to the Special Issue Modeling and Simulation of Advanced Composite Materials)

Abstract

The breakage of capsules upon crack propagation is crucial for achieving crack healing in encapsulation-based self-healing materials. A mesomechanical model was developed in this study to simulate the process of crack propagation in a matrix and the potential of debonding. The model used the extended finite element method (XFEM) combined with a cohesive zone model (CZM) in a two-dimensional (2D) configuration. The configuration consisted of an infinite matrix with an embedded crack and a capsule nearby, all subjected to a uniaxial remote tensile load. A parametric study was performed to investigate the effect of geometry, elastic parameters and fracture properties on the fracture response of the system. The results indicated that the effect of the capsule wall on the fracture behavior of the matrix is insignificant for tc/Rc ≤ 0.05. The matrix strength influenced the ultimate crack length, while the Young’s modulus ratio Ec/Em only affected the rate of crack propagation. The potential for capsule breakage or debonding was dependent on the comparative strength between capsule and interface (Sc/Sint), provided the crack could reach the capsule. The critical value of Sc,cr/Sint,cr was obtained using this model for materials design. View Full-Text
Keywords: encapsulation-based; self-healing; interface fracture; cohesive zone encapsulation-based; self-healing; interface fracture; cohesive zone
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Li, W.; Jiang, Z.; Yang, Z. Crack Extension and Possibility of Debonding in Encapsulation-Based Self-Healing Materials. Materials 2017, 10, 589.

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