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Materials 2017, 10(5), 558; doi:10.3390/ma10050558

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

1
School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
2
Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
3
State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Institute of Mechanical Engineering, Zhengzhou 450001, China
*
Author to whom correspondence should be addressed.
Received: 3 March 2017 / Revised: 16 May 2017 / Accepted: 17 May 2017 / Published: 19 May 2017
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Abstract

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles. When the addition of CuZnAl particles was 0.2 wt %, the wettability of the Sn-58Bi solder performed best. At the same time, excessive addition of CuZnAl particles led to poor wettability. However, the results showed that CuZnAl particles changed the melting point of the Sn-58Bi solder slightly. The microstructure of the Sn-58Bi solder was refined by adding CuZnAl particles. When the content of CuZnAl addition was between 0.1 and 0.2 wt %, the refinement was great. In addition, the interfacial IMC layer between new composite solder and Cu substrate was thinner than that between the Sn-58Bi solder and Cu substrate. View Full-Text
Keywords: Sn-58Bi solder; lead-free solder; microstructure Sn-58Bi solder; lead-free solder; microstructure
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Yang, F.; Zhang, L.; Liu, Z.-Q.; Zhong, S.J.; Ma, J.; Bao, L. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder. Materials 2017, 10, 558.

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