Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes
AbstractThis article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used, respectively, as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS. View Full-Text
- Supplementary File 1:
ZIP-Document (ZIP, 10579 KB)
Scifeed alert for new publicationsNever miss any articles matching your research from any publisher
- Get alerts for new papers matching your research
- Find out the new papers from selected authors
- Updated daily for 49'000+ journals and 6000+ publishers
- Define your Scifeed now
Schiavone, G.; Murray, J.; Perry, R.; Mount, A.R.; Desmulliez, M.P.Y.; Walton, A.J. Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes. Materials 2017, 10, 323.
Schiavone G, Murray J, Perry R, Mount AR, Desmulliez MPY, Walton AJ. Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes. Materials. 2017; 10(3):323.Chicago/Turabian Style
Schiavone, Giuseppe; Murray, Jeremy; Perry, Richard; Mount, Andrew R.; Desmulliez, Marc P.Y.; Walton, Anthony J. 2017. "Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes." Materials 10, no. 3: 323.
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.