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Materials 2017, 10(3), 323; doi:10.3390/ma10030323

Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes

1
SMC, School of Engineering, University of Edinburgh, Edinburgh EH9 3FF, UK
2
School of Chemistry, University of Edinburgh, Edinburgh EH9 3FF, UK
3
School of Engineering & Physical Sciences, Heriot-Watt University, Edinburgh EH14 4AS, UK
*
Author to whom correspondence should be addressed.
Academic Editor: Fei Tang
Received: 9 February 2017 / Revised: 12 March 2017 / Accepted: 17 March 2017 / Published: 22 March 2017
(This article belongs to the Section Manufacturing Processes and Systems)
View Full-Text   |   Download PDF [41645 KB, uploaded 22 March 2017]   |  

Abstract

This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used, respectively, as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS. View Full-Text
Keywords: Ni-Fe integration; Permalloy; MEMS; surface micromachining; selective etching; Ni-Fe electroplating; magnetic microactuators Ni-Fe integration; Permalloy; MEMS; surface micromachining; selective etching; Ni-Fe electroplating; magnetic microactuators
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Schiavone, G.; Murray, J.; Perry, R.; Mount, A.R.; Desmulliez, M.P.Y.; Walton, A.J. Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes. Materials 2017, 10, 323.

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