Next Article in Journal
3D Printing of Cytocompatible Water-Based Light-Cured Polyurethane with Hyaluronic Acid for Cartilage Tissue Engineering Applications
Previous Article in Journal
Influence of Resin Composition on the Defect Formation in Alumina Manufactured by Stereolithography
Article Menu
Issue 2 (February) cover image

Export Article

Open AccessArticle
Materials 2017, 10(2), 137; doi:10.3390/ma10020137

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

1
Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China
2
State Key Laboratory for Marine Corrosion and Protection, Luoyang Ship Material Research Institute, Qingdao 266101, China
3
Ningbo Institute of Material Technology & Engineering, Chinese Academy of Sciences, Ningbo 315201, China
*
Author to whom correspondence should be addressed.
Academic Editor: Haolin Tang
Received: 17 January 2017 / Revised: 3 February 2017 / Accepted: 6 February 2017 / Published: 8 February 2017
View Full-Text   |   Download PDF [10287 KB, uploaded 8 February 2017]   |  

Abstract

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. View Full-Text
Keywords: electrochemical migration; copper dendrites; PCB-Cu; PCB-ENIG; thin electrolyte layer electrochemical migration; copper dendrites; PCB-Cu; PCB-ENIG; thin electrolyte layer
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Yi, P.; Xiao, K.; Ding, K.; Dong, C.; Li, X. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers. Materials 2017, 10, 137.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top