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Journal: Materials, 2017
Volume: 10
Number: 1220

Article: Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests
Authors: by Chang-Chun Lee
Link: https://www.mdpi.com/1996-1944/10/10/1220

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