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Materials 2017, 10(1), 1;

Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder

Department of Materials Science and Engineering, Research Center for Energy Technology and Strategy, National Cheng-Kung University, No. 1, Ta-Hsueh Road, Tainan 70101, Taiwan
Author to whom correspondence should be addressed.
Academic Editors: Guillermo Requena and Juergen Stampfl
Received: 5 September 2016 / Revised: 6 December 2016 / Accepted: 16 December 2016 / Published: 22 December 2016
(This article belongs to the Special Issue Metals for Additive Manufacturing)
View Full-Text   |   Download PDF [7173 KB, uploaded 22 December 2016]   |  


This study aims to determine the effects of appropriate experimental parameters on the thermophysical properties of molten micro droplets, Sn-3Ag-0.5Cu solder balls with an average droplet diameter of 50 μm were prepared. The inkjet printing parameters of the molten micro droplets, such as the dot spacing, stage velocity and sample temperature, were optimized in the 1D and 2D printing of metallic microstructures. The impact and mergence of molten micro droplets were observed with a high-speed digital camera. The line width of each sample was then calculated using a formula over a temperature range of 30 to 70 °C. The results showed that a metallic line with a width of 55 μm can be successfully printed with dot spacing (50 μm) and the stage velocity (50 mm∙s−1) at the substrate temperature of 30 °C. The experimental results revealed that the height (from 0.63 to 0.58) and solidification contact angle (from 72° to 56°) of the metallic micro droplets decreased as the temperature of the sample increased from 30 to 70 °C. High-speed digital camera (HSDC) observations showed that the quality of the 3D micro patterns improved significantly when the droplets were deposited at 70 °C. View Full-Text
Keywords: lead-free solder; inkjet printing; micro patterns; micro droplet; metallic line lead-free solder; inkjet printing; micro patterns; micro droplet; metallic line

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Wang, C.-H.; Tsai, H.-L.; Hwang, W.-S. Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder. Materials 2017, 10, 1.

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