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Energies 2016, 9(8), 608; doi:10.3390/en9080608

Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration

1
Energy Department, Politecnico di Torino, Corso Duca degli Abruzzi 24, 10129 Torino (TO), Italy
2
DENSO Thermal Systems, 10046 Poirino (TO), Italy
*
Author to whom correspondence should be addressed.
Academic Editor: Kamel Hooman
Received: 8 March 2016 / Revised: 30 June 2016 / Accepted: 27 July 2016 / Published: 2 August 2016
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Abstract

Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooling. Because of the many design parameters to be considered, developing both cost and thermal effective PFHS is a critical issue. Here, a novel thermal model of PFHS is presented. The model has a broad field of applicability, being comprehensive of the effects of flow bypass, developing boundary layers, fin efficiency and spreading resistance. Experiments are then carried out to validate the proposed thermal model, and its good accuracy is demonstrated. Finally, an optimization methodology based on genetic algorithms is proposed for a cost-effective selection of the design parameters of PFHS, which is particularly effective with semi-active configurations. Such an optimization methodology is then tested on a commercial heat sink, resulting in a possible 53% volume reduction at fixed thermal performances. View Full-Text
Keywords: heat transfer enhancement; electronics cooling; plate fin heat sinks; cost optimization; genetic algorithms heat transfer enhancement; electronics cooling; plate fin heat sinks; cost optimization; genetic algorithms
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Ventola, L.; Curcuruto, G.; Fasano, M.; Fotia, S.; Pugliese, V.; Chiavazzo, E.; Asinari, P. Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration. Energies 2016, 9, 608.

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