Sensors 2009, 9(12), 9629-9665; doi:10.3390/s91209629
Article

Bundle Block Adjustment with 3D Natural Cubic Splines

Department of Civil and Environmental Engineering, Seoul National University, 599 Gwanak-ro, Gwanak-gu, Seoul 151-742, Korea
* Author to whom correspondence should be addressed.
Received: 12 October 2009 / Accepted: 15 November 2009 / Published: 2 December 2009
(This article belongs to the Section Remote Sensors)
PDF Full-text Download PDF Full-Text [947 KB, uploaded 3 December 2009 08:59 CET]
Abstract: Point-based methods undertaken by experienced human operators are very effective for traditional photogrammetric activities, but they are not appropriate in the autonomous environment of digital photogrammetry. To develop more reliable and accurate techniques, higher level objects with linear features accommodating elements other than points are alternatively adopted for aerial triangulation. Even though recent advanced algorithms provide accurate and reliable linear feature extraction, the use of such features that can consist of complex curve forms is more difficult than extracting a discrete set of points. Control points that are the initial input data, and break points that are end points of segmented curves, are readily obtained. Employment of high level features increases the feasibility of using geometric information and provides access to appropriate analytical solutions for advanced computer technology.
Keywords: bundle block adjustment; 3D natural cubic splines; arc-length parameterization; linear features; line photogrammetry

Article Statistics

Click here to load and display the download statistics.

Cite This Article

MDPI and ACS Style

Lee, W.H.; Yu, K. Bundle Block Adjustment with 3D Natural Cubic Splines. Sensors 2009, 9, 9629-9665.

AMA Style

Lee W.H., Yu K. Bundle Block Adjustment with 3D Natural Cubic Splines. Sensors. 2009; 9(12):9629-9665.

Chicago/Turabian Style

Lee, Won Hee; Yu, Kiyun. 2009. "Bundle Block Adjustment with 3D Natural Cubic Splines." Sensors 9, no. 12: 9629-9665.

Sensors EISSN 1424-8220 Published by MDPI Publishing, Basel, Switzerland RSS E-Mail Table of Contents Alert