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Sensors 2009, 9(1), 556-567; doi:10.3390/s90100556
Article

Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

1,* , 1, 1 and 2
Received: 12 December 2008; in revised form: 10 January 2009 / Accepted: 13 January 2009 / Published: 19 January 2009
(This article belongs to the Special Issue State-of-the-Art Sensors Technology in Italy)
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Abstract: Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.
Keywords: inertial MEMS sensors; impact-induced failure; dynamic fracture; multi-scale FE analysis inertial MEMS sensors; impact-induced failure; dynamic fracture; multi-scale FE analysis
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Mariani, S.; Ghisi, A.; Corigliano, A.; Zerbini, S. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach. Sensors 2009, 9, 556-567.

AMA Style

Mariani S, Ghisi A, Corigliano A, Zerbini S. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach. Sensors. 2009; 9(1):556-567.

Chicago/Turabian Style

Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah. 2009. "Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach." Sensors 9, no. 1: 556-567.


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