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Sensors 2009, 9(1), 556-567; doi:10.3390/s90100556

Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

1
Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Piazza Leonardo da Vinci 32, 20133 – Milano, Italy
2
MAHRS Unit, STMicroelectronics, Via Tolomeo 1, 20010 – Cornaredo, Italy
*
Author to whom correspondence should be addressed.
Received: 12 December 2008 / Revised: 10 January 2009 / Accepted: 13 January 2009 / Published: 19 January 2009
(This article belongs to the Special Issue State-of-the-Art Sensors Technology in Italy)
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Abstract

Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.
Keywords: inertial MEMS sensors; impact-induced failure; dynamic fracture; multi-scale FE analysis inertial MEMS sensors; impact-induced failure; dynamic fracture; multi-scale FE analysis
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Mariani, S.; Ghisi, A.; Corigliano, A.; Zerbini, S. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach. Sensors 2009, 9, 556-567.

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