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Journal: Sensors, 2008
Volume: 8
Page(s): 7438-7452
7438-7452
Article: Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer
Hamzah, A.A.; Yunas, J.; Majlis, B.Y.; Ahmad, I.

http://www.mdpi.com/1424-8220/8/11/7438

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