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Sensors 2018, 18(8), 2554; https://doi.org/10.3390/s18082554

High Strain Survivability of Piezoceramics by Optimal Bonding Adhesive Design

1
School of Aerospace Engineering, Xiamen University, Xiamen 361005, China
2
School of Aeronautics and Astronautics, Dalian University of Technology, Dalian 116024, China
*
Author to whom correspondence should be addressed.
Received: 1 July 2018 / Revised: 31 July 2018 / Accepted: 2 August 2018 / Published: 4 August 2018
(This article belongs to the Section Physical Sensors)
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Abstract

As one of the most common transducers used in structural health monitoring (SHM), piezoceramic sensors can play an important role in both damage detection and impact monitoring. However, the low tensile strain survivability of piezoceramics resulting from the material nature significantly limits their application on SHM in the aerospace industry. This paper proposes a novel approach to greatly improve the strain survivability of piezoceramics by optimal design of the adhesive used to bond them to the host structure. Theoretical model for determining the strain transfer coefficient through bonded adhesive from the host structure to piezoceramic is first established. Finite element analysis is then utilized to study the parameters of adhesive, including thickness and shear modulus. Experiments are finally conducted to validate the proposed method, and results show the piezoceramic sensors still work well when they are bonded on the host structures with tensile strain up to 4000 με by using the optimal adhesive. View Full-Text
Keywords: adhesive; piezoceramic; sensor; strain survivability; structural health monitoring adhesive; piezoceramic; sensor; strain survivability; structural health monitoring
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Sun, H.; Wang, Y.; Qing, X.; Wu, Z. High Strain Survivability of Piezoceramics by Optimal Bonding Adhesive Design. Sensors 2018, 18, 2554.

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