Next Article in Journal
Network Location-Aware Service Recommendation with Random Walk in Cyber-Physical Systems
Next Article in Special Issue
Autonomous Microsystems for Downhole Applications: Design Challenges, Current State, and Initial Test Results
Previous Article in Journal
A Tailored Ontology Supporting Sensor Implementation for the Maintenance of Industrial Machines
Article Menu
Issue 9 (September) cover image

Export Article

Open AccessReview
Sensors 2017, 17(9), 2061; https://doi.org/10.3390/s17092061

Thermal Flow Sensors for Harsh Environments

1
Queensland Micro- and Nanotechnology Centre, Griffith University, Brisbane 4111, QLD, Australia
2
School of Engineering, Griffith University, Gold Coast 4222, QLD, Australia
*
Author to whom correspondence should be addressed.
Received: 14 July 2017 / Revised: 3 September 2017 / Accepted: 4 September 2017 / Published: 8 September 2017
(This article belongs to the Special Issue Sensors and Materials for Harsh Environments)
View Full-Text   |   Download PDF [4743 KB, uploaded 8 September 2017]   |  

Abstract

Flow sensing in hostile environments is of increasing interest for applications in the automotive, aerospace, and chemical and resource industries. There are thermal and non-thermal approaches for high-temperature flow measurement. Compared to their non-thermal counterparts, thermal flow sensors have recently attracted a great deal of interest due to the ease of fabrication, lack of moving parts and higher sensitivity. In recent years, various thermal flow sensors have been developed to operate at temperatures above 500 °C. Microelectronic technologies such as silicon-on-insulator (SOI), and complementary metal-oxide semiconductor (CMOS) have been used to make thermal flow sensors. Thermal sensors with various heating and sensing materials such as metals, semiconductors, polymers and ceramics can be selected according to the targeted working temperature. The performance of these thermal flow sensors is evaluated based on parameters such as thermal response time, flow sensitivity. The data from thermal flow sensors reviewed in this paper indicate that the sensing principle is suitable for the operation under harsh environments. Finally, the paper discusses the packaging of the sensor, which is the most important aspect of any high-temperature sensing application. Other than the conventional wire-bonding, various novel packaging techniques have been developed for high-temperature application. View Full-Text
Keywords: thermal flow; harsh environment; operational modes; transduction; materials; properties and packaging thermal flow; harsh environment; operational modes; transduction; materials; properties and packaging
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Balakrishnan, V.; Phan, H.-P.; Dinh, T.; Dao, D.V.; Nguyen, N.-T. Thermal Flow Sensors for Harsh Environments. Sensors 2017, 17, 2061.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top