Next Article in Journal
Integration of Sensors, Controllers and Instruments Using a Novel OPC Architecture
Next Article in Special Issue
Highly Sensitive Hot-Wire Anemometry Based on Macro-Sized Double-Walled Carbon Nanotube Strands
Previous Article in Journal
Analysis of Public Datasets for Wearable Fall Detection Systems
Previous Article in Special Issue
n+ GaAs/AuGeNi-Au Thermocouple-Type RF MEMS Power Sensors Based on Dual Thermal Flow Paths in GaAs MMIC
Article Menu
Issue 7 (July) cover image

Export Article

Open AccessArticle
Sensors 2017, 17(7), 1511; doi:10.3390/s17071511

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

1
Institute for Micro Assembly Technology, Hahn-Schickard e. V, Allmandring 9B, 70569 Stuttgart, Germany
2
Institut für Mikroelektronik Stuttgart, Allmandring 30a, 70569 Stuttgart, Germany
3
Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9B, 70569 Stuttgart, Germany
*
Author to whom correspondence should be addressed.
Received: 8 April 2017 / Revised: 12 June 2017 / Accepted: 21 June 2017 / Published: 27 June 2017
(This article belongs to the Special Issue MEMS and Nano-Sensors)
View Full-Text   |   Download PDF [4630 KB, uploaded 29 June 2017]   |  

Abstract

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low-volume production are the main requirements for future solutions in packaging. This study investigates possibilities employing printed circuit board (PCB-)based assemblies to provide high flexibility for circuit designs together with film-assisted transfer molding (FAM) to package sensors. The feasibility of FAM in combination with PCB and MEMS as a packaging technology for highly sensitive inertia sensors is being demonstrated. The results prove the technology to be a viable method for damage-free packaging of stress- and pressure-sensitive MEMS. View Full-Text
Keywords: packaging; MEMS; EMC; FAM; button shear test packaging; MEMS; EMC; FAM; button shear test
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Hera, D.; Berndt, A.; Günther, T.; Schmiel, S.; Harendt, C.; Zimmermann, A. Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors 2017, 17, 1511.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top