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Sensors 2017, 17(6), 1420; doi:10.3390/s17061420

Fabrication of Circuits on Flexible Substrates Using Conductive SU-8 for Sensing Applications

1
Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, BC V6T 1Z4, Canada
2
Department of Mechanical Engineering, University of British Columbia, Vancouver, BC V6T 1Z4, Canada
*
Author to whom correspondence should be addressed.
Received: 25 April 2017 / Revised: 7 June 2017 / Accepted: 15 June 2017 / Published: 17 June 2017
(This article belongs to the Section Physical Sensors)
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Abstract

This article describes a new low-cost rapid microfabrication technology for high-density interconnects and passive devices on flexible substrates for sensing applications. Silver nanoparticles with an average size of 80 nm were used to create a conductive SU-8 mixture with a concentration of wt 25%. The patterned structures after hard baking have a sheet resistance of 11.17 Ω /□. This conductive SU-8 was used to pattern planar inductors, capacitors and interconnection lines on flexible Kapton film. The conductive SU-8 structures were used as a seed layer for a subsequent electroplating process to increase the conductivity of the devices. Examples of inductors, resistor-capacitor (RC) and inductor-capacitor (LC) circuits, interconnection lines and a near-field communication (NFC) antenna are presented as a demonstration. As an example of high-resolution miniaturization, we fabricated microinductors having line widths of 5 μ m. Mechanical bending tests were successful down to a 5 mm radius. To the best of the authors’ knowledge, this is the first report of conductive SU-8 used to fabricate such planar devices and the first on flexible substrates. This is a proof of concept that this fabrication approach can be used as an alternative for microfabrication of planar passive devices on flexible substrates. View Full-Text
Keywords: SU-8; silver nanoparticles; percolation threshold; planar inductors; passive filters; interconnections SU-8; silver nanoparticles; percolation threshold; planar inductors; passive filters; interconnections
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Gerardo, C.D.; Cretu, E.; Rohling, R. Fabrication of Circuits on Flexible Substrates Using Conductive SU-8 for Sensing Applications. Sensors 2017, 17, 1420.

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