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Sensors 2015, 15(12), 31821-31832; doi:10.3390/s151229885

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

1
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan
2
Electronics-Inspired Interdisciplinary Research Institute (EIIRIS), Toyohashi University of Technology, Aichi 441-8580, Japan
*
Author to whom correspondence should be addressed.
Academic Editor: Hung Cao
Received: 9 October 2015 / Revised: 5 December 2015 / Accepted: 14 December 2015 / Published: 16 December 2015
(This article belongs to the Section Physical Sensors)
View Full-Text   |   Download PDF [6510 KB, uploaded 16 December 2015]   |  

Abstract

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction. View Full-Text
Keywords: wireless power transmission; wafer-level packaging; flip-chip bonding; flexible substrate; rectenna wireless power transmission; wafer-level packaging; flip-chip bonding; flexible substrate; rectenna
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Okabe, K.; Jeewan, H.P.; Yamagiwa, S.; Kawano, T.; Ishida, M.; Akita, I. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors 2015, 15, 31821-31832.

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