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Sensors 2015, 15(10), 25882-25897; doi:10.3390/s151025882

Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

1
School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
2
School of Electrical and Electronic Engineering, Newcastle University, Newcastle upon Tyne NE1 7R, UK
*
Author to whom correspondence should be addressed.
Academic Editor: Vittorio M. N. Passaro
Received: 15 July 2015 / Revised: 11 September 2015 / Accepted: 14 September 2015 / Published: 13 October 2015
(This article belongs to the Section Physical Sensors)
View Full-Text   |   Download PDF [2484 KB, uploaded 13 October 2015]   |  

Abstract

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. View Full-Text
Keywords: flip-chip solder balls; eddy current pulsed; infrared thermography; defect detection flip-chip solder balls; eddy current pulsed; infrared thermography; defect detection
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Zhou, X.; Zhou, J.; Tian, G.; Wang, Y. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography. Sensors 2015, 15, 25882-25897.

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