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Sensors 2014, 14(2), 2417-2430; doi:10.3390/s140202417
Article

A High Temperature Capacitive Pressure Sensor Based on Alumina Ceramic for in Situ Measurement at 600 °C

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1 Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China 2 Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Tai Yuan 030051, China
* Authors to whom correspondence should be addressed.
Received: 25 December 2013 / Revised: 22 January 2014 / Accepted: 23 January 2014 / Published: 30 January 2014
(This article belongs to the Section Physical Sensors)
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Abstract

In response to the growing demand for in situ measurement of pressure in high-temperature environments, a high temperature capacitive pressure sensor is presented in this paper. A high-temperature ceramic material-alumina is used for the fabrication of the sensor, and the prototype sensor consists of an inductance, a variable capacitance, and a sealed cavity integrated in the alumina ceramic substrate using a thick-film integrated technology. The experimental results show that the proposed sensor has stability at 850 °C for more than 20 min. The characterization in high-temperature and pressure environments successfully demonstrated sensing capabilities for pressure from 1 to 5 bar up to 600 °C, limited by the sensor test setup. At 600 °C, the sensor achieves a linear characteristic response, and the repeatability error, hysteresis error and zero-point drift of the sensor are 8.3%, 5.05% and 1%, respectively.
Keywords: high-temperature pressure sensor; in situ test; alumina ceramic; LC circuit high-temperature pressure sensor; in situ test; alumina ceramic; LC circuit
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).
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Tan, Q.; Li, C.; Xiong, J.; Jia, P.; Zhang, W.; Liu, J.; Xue, C.; Hong, Y.; Ren, Z.; Luo, T. A High Temperature Capacitive Pressure Sensor Based on Alumina Ceramic for in Situ Measurement at 600 °C. Sensors 2014, 14, 2417-2430.

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