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Sensors 2014, 14(1), 52-67; doi:10.3390/s140100052
Article

Dimension Reduction of Multivariable Optical Emission Spectrometer Datasets for Industrial Plasma Processes

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Received: 10 October 2013; in revised form: 4 December 2013 / Accepted: 16 December 2013 / Published: 19 December 2013
(This article belongs to the Section Physical Sensors)
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Abstract: A new data dimension-reduction method, called Internal Information Redundancy Reduction (IIRR), is proposed for application to Optical Emission Spectroscopy (OES) datasets obtained from industrial plasma processes. For example in a semiconductor manufacturing environment, real-time spectral emission data is potentially very useful for inferring information about critical process parameters such as wafer etch rates, however, the relationship between the spectral sensor data gathered over the duration of an etching process step and the target process output parameters is complex. OES sensor data has high dimensionality (fine wavelength resolution is required in spectral emission measurements in order to capture data on all chemical species involved in plasma reactions) and full spectrum samples are taken at frequent time points, so that dynamic process changes can be captured. To maximise the utility of the gathered dataset, it is essential that information redundancy is minimised, but with the important requirement that the resulting reduced dataset remains in a form that is amenable to direct interpretation of the physical process. To meet this requirement and to achieve a high reduction in dimension with little information loss, the IIRR method proposed in this paper operates directly in the original variable space, identifying peak wavelength emissions and the correlative relationships between them. A new statistic, Mean Determination Ratio (MDR), is proposed to quantify the information loss after dimension reduction and the effectiveness of IIRR is demonstrated using an actual semiconductor manufacturing dataset. As an example of the application of IIRR in process monitoring/control, we also show how etch rates can be accurately predicted from IIRR dimension-reduced spectral data.
Keywords: dimension reduction; OES; plasma etching process; OES output pattern dimension reduction; OES; plasma etching process; OES output pattern
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Yang, J.; McArdle, C.; Daniels, S. Dimension Reduction of Multivariable Optical Emission Spectrometer Datasets for Industrial Plasma Processes. Sensors 2014, 14, 52-67.

AMA Style

Yang J, McArdle C, Daniels S. Dimension Reduction of Multivariable Optical Emission Spectrometer Datasets for Industrial Plasma Processes. Sensors. 2014; 14(1):52-67.

Chicago/Turabian Style

Yang, Jie; McArdle, Conor; Daniels, Stephen. 2014. "Dimension Reduction of Multivariable Optical Emission Spectrometer Datasets for Industrial Plasma Processes." Sensors 14, no. 1: 52-67.



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