Int. J. Mol. Sci. 2007, 8(8), 864-883; doi:10.3390/i8080864
Review

Developments in Molecular Recognition and Sensing at Interfaces

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Received: 6 August 2007; Accepted: 20 August 2007 / Published: 22 August 2007
(This article belongs to the Section Molecular Recognition)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract: In biological systems, molecular recognition events occur mostly withininterfacial environments such as at membrane surfaces, enzyme reaction sites, or at theinterior of the DNA double helix. Investigation of molecular recognition at model interfacesprovides great insights into biological phenomena. Molecular recognition at interfaces notonly has relevance to biological systems but is also important for modern applications suchas high sensitivity sensors. Selective binding of guest molecules in solution to hostmolecules located at solid surfaces is crucial for electronic or photonic detection of analytesubstances. In response to these demands, molecular recognition at interfaces has beeninvestigated extensively during the past two decades using Langmuir monolayers, self-assembled monolayers, and lipid assemblies as recognition media. In this review, advancesof molecular recognition at interfaces are briefly summarized.
Keywords: molecular recognition; interface; air-water interface; Langmuir-Blodgett film; self-assembled monolayer; molecular assembly.
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MDPI and ACS Style

Ariga, K.; Hill, J.P.; Endo, H. Developments in Molecular Recognition and Sensing at Interfaces. Int. J. Mol. Sci. 2007, 8, 864-883.

AMA Style

Ariga K, Hill JP, Endo H. Developments in Molecular Recognition and Sensing at Interfaces. International Journal of Molecular Sciences. 2007; 8(8):864-883.

Chicago/Turabian Style

Ariga, Katsuhiko; Hill, Jonathan P.; Endo, Hiroshi. 2007. "Developments in Molecular Recognition and Sensing at Interfaces." Int. J. Mol. Sci. 8, no. 8: 864-883.


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