Deciphering Molecular Mechanisms of Interface Buildup and Stability in Porous Si/Eumelanin Hybrids
AbstractPorous Si/eumelanin hybrids are a novel class of organic–inorganic hybrid materials that hold considerable promise for photovoltaic applications. Current progress toward device setup is, however, hindered by photocurrent stability issues, which require a detailed understanding of the mechanisms underlying the buildup and consolidation of the eumelanin–silicon interface. Herein we report an integrated experimental and computational study aimed at probing interface stability via surface modification and eumelanin manipulation, and at modeling the organic–inorganic interface via formation of a 5,6-dihydroxyindole (DHI) tetramer and its adhesion to silicon. The results indicated that mild silicon oxidation increases photocurrent stability via enhancement of the DHI–surface interaction, and that higher oxidation states in DHI oligomers create more favorable conditions for the efficient adhesion of growing eumelanin. View Full-Text
- Supplementary File 1:
Supplementary (PDF, 2422 KB)
Share & Cite This Article
Pinna, E.; Melis, C.; Antidormi, A.; Cardia, R.; Sechi, E.; Cappellini, G.; d’Ischia, M.; Colombo, L.; Mula, G. Deciphering Molecular Mechanisms of Interface Buildup and Stability in Porous Si/Eumelanin Hybrids. Int. J. Mol. Sci. 2017, 18, 1567.
Pinna E, Melis C, Antidormi A, Cardia R, Sechi E, Cappellini G, d’Ischia M, Colombo L, Mula G. Deciphering Molecular Mechanisms of Interface Buildup and Stability in Porous Si/Eumelanin Hybrids. International Journal of Molecular Sciences. 2017; 18(7):1567.Chicago/Turabian Style
Pinna, Elisa; Melis, Claudio; Antidormi, Aleandro; Cardia, Roberto; Sechi, Elisa; Cappellini, Giancarlo; d’Ischia, Marco; Colombo, Luciano; Mula, Guido. 2017. "Deciphering Molecular Mechanisms of Interface Buildup and Stability in Porous Si/Eumelanin Hybrids." Int. J. Mol. Sci. 18, no. 7: 1567.
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.