Entropy 2015, 17(5), 3438-3457; https://doi.org/10.3390/e17053438
Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers
1
Department of Mechanical Engineering, Korea University, Seoul 136-713, Korea
2
Samsung Electronics Co., Ltd., Maetan 3-dong, Yeongtong-gu, Suwon 443-742, Korea
3
Department of Mechanical Engineering, Korea National University of Transportation, Chungbuk 380-702, Korea
*
Author to whom correspondence should be addressed.
Academic Editor: Kevin H. Knuth
Received: 11 January 2015 / Revised: 11 May 2015 / Accepted: 13 May 2015 / Published: 18 May 2015
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Abstract
Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%‒15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number. View Full-TextKeywords:
microchannel; printed circuit heat exchanger (PCHE); micro photo-etching; diffusion bonding; counterflow
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MDPI and ACS Style
Seo, J.-W.; Kim, Y.-H.; Kim, D.; Choi, Y.-D.; Lee, K.-J. Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers. Entropy 2015, 17, 3438-3457.